Micron Breaks Ground on Its $15 Billion EUV DRAM Fab in the U.S.

Micron this week broke ground on its leading-edge memory production facility near Boise, Idaho. The company will invest $15 billion in its new fab as a part of its...

23 by Anton Shilov on 9/14/2022

SK Hynix Starts Prepping for Next Semiconductor Boom with $11 Billion Memory Fab

When a major South Korean memory firm invests over $11 billion in a fab, that raises a couple of eyebrows. But when it comes within a major $100+ billion...

6 by Anton Shilov on 9/8/2022

Intel Kicks Off Fab Co-Investment Program with Brookfield: New Fabs to be Jointly Owned

Intel this week introduced its new Semiconductor Co-Investment Program (SCIP) under which it will build new manufacturing facilities in collaboration with investment partners – a sharp departure from the...

28 by Anton Shilov on 8/24/2022

Samsung's $15 Billion R&D Complex to Overcome Limits of Semiconductor Scaling

Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research...

26 by Anton Shilov on 8/19/2022

TSMC and ASML: Demand for Chips Remains Strong, But Getting Fab Tools Is Hard

TSMC's revenue this year is going to set an all-time record for the company, thanks to high demand for chips as well as increased prices that its customers are...

13 by Anton Shilov on 7/21/2022

TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later

When TSMC initially introduced its N2 (2 nm class) process technology earlier this month, the company outlined how the new node would be built on the back of two...

16 by Anton Shilov on 6/29/2022

TSMC to Customers: It's Time to Stop Using Older Nodes and Move to 28nm

We tend to discuss leading-edge nodes and the most advanced chips made using them, but there are thousands of chip designs developed years ago that are made using what...

20 by Anton Shilov on 6/29/2022

As HPC Chip Sizes Grow, So Does the Need For 1kW+ Chip Cooling

One trend in the high performance computing (HPC) space that is becoming increasingly clear is that power consumption per chip and per rack unit is not going to stop...

40 by Anton Shilov on 6/27/2022

TSMC to Expand Capacity for Mature and Specialty Nodes by 50%

TSMC this afternoon has disclosed that it will expand its production capacity for mature and specialized nodes by about 50% by 2025. The plan includes building numerous new fabs...

13 by Anton Shilov on 6/16/2022

TSMC Unveils N2 Process Node: Nanosheet-based GAAFETs Bring Significant Benefits In 2025

At its 2022 Technology Symposium, TSMC formally unveiled its N2 (2 nm class) fabrication technology, which is slated to go into production some time in 2025 and will be...

24 by Anton Shilov on 6/16/2022

TSMC Readies Five 3nm Process Technologies, Adds FinFlex For Design Flexibility

Taiwan Semiconductor Manufacturing Co. on Thursday kicked off its 2022 TSMC Technology Symposium, where the company traditionally shares it process technology roadmaps as well as its future expansion plans...

44 by Anton Shilov on 6/16/2022

Destination 30 TB: HDD Vendors Plan Different Routes to Hit Storage Milestone in 2023

In the recent months all three hard drive manufacturers — Seagate, Toshiba, and Western Digital — and some of their partners have outlined plans to ship 30TB HDDs already...

24 by Anton Shilov on 6/3/2022

ASML High-NA Development Update: Coming to Fabs in 2024 - 2025

It took the semiconductor industry over a decade to prep everything needed for production of chips using extreme ultraviolet (EUV) lithography. It looks like it is going to take...

8 by Anton Shilov on 5/26/2022

Applied Materials Outlines Next-Gen Tools for 3nm and GAA Transistor Era

Last month Samsung Foundry quietly announced that it was set to begin producing chips using its 3GAE (3 nm-class, gate-all-around transistors, early) process technology in the second quarter. While...

17 by Anton Shilov on 5/12/2022

TSMC Roadmap Update: N3E in 2024, N2 in 2026, Major Changes Incoming

Taiwan Semiconductor Manufacturing Co. has solid plans for the next few years, but the foundry's manufacturing technology design cycles are getting longer. As a result, to address all of...

21 by Anton Shilov on 4/22/2022

TSMC Unveils N4X Node: Extreme High-Performance at High Voltages

TSMC this week announced a new fabrication process that is tailored specifically for high-performance computing (HPC) products. N4X promises to combine transistor density and design rules of TSMC's N5-family...

42 by Anton Shilov on 12/17/2021

Semi CapEx to Hit $152 Billion in 2021 as Market on Track for $2 Trillion by 2035

Semiconductor makers have drastically increased their capital expenditures (CapEx) this year in response to unprecedented demand for chips that is going to last for years. Now the CEO of...

8 by Anton Shilov on 12/17/2021

Western Digital Spills Beans on HDD Plans: 30TB HDDs Planned, MAMR's Future Unclear

Western Digital this week said that its energy-assisted magnetic recording (ePMR) and OptiNAND technologies coupled with increased number of platters per hard drive would enable it to build HDDs...

41 by Anton Shilov on 12/2/2021

Texas To Get Multiple New Fabs as Samsung and TI to Spend $47 Billion on New Facilities

After a year of searching for the right place of its new U.S. fab, Samsung this week announced that it would build a fab near Taylor, Texas. The company...

135 by Anton Shilov on 11/24/2021

TSMC Roadmap Update: 3nm in Q1 2023, 3nm Enhanced in 2024, 2nm in 2025

TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting...

32 by Anton Shilov on 10/18/2021

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